Variable resolution digital equalization

ABSTRACT

A receiver includes a variable resolution analog-to-digital converter (ADC) and variable resolution processing logic/circuitry. The processing logic may use feed-forward equalization (FFE) techniques to process the outputs from the ADC. When receiving data from a channel having low attenuation, distortion, and/or noise, the ADC and processing logic may be configured to sample and process the received signal using fewer bits, and therefore less logic, than when configured to receiving data from a channel having a higher attenuation, distortion, and/or noise. Thus, the number of (valid) bits output by the ADC, and subsequently processed (e.g., for FFE equalization) can be reduced when a receiver of this type is coupled to a low loss channel. These reductions can reduce power consumption when compared to operating the receiver using the full (i.e., maximum) number of bits the ADC and processing logic is capable of processing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a digital data communicationsystem.

FIGS. 2A-2C are diagrams illustrating variable resolution datareception.

FIG. 3 is a block diagram illustrating a successive approximationanalog-to-digital converter (ADC).

FIG. 4 is a timing diagram illustrating variable resolution operation ofa successive approximation analog-to-digital converter.

FIGS. 5A-5B are diagrams illustrating variable resolution operation of aflash analog-to-digital converter.

FIGS. 6A-6B are diagrams illustrating variable resolution operation of apipeline analog-to-digital converter.

FIG. 7 is a flowchart illustrating variable resolution data reception.

FIG. 8 is an illustration comparing eye diagrams having differentsampling and processing resolutions.

FIG. 9 is a block diagram of a processing system.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various embodiments described herein relate to a system includingintegrated circuit devices, for example, memory devices and/or at leasta memory controller device that controls such memory devices (andmethods of operation of these respective devices). Integrated circuitdevices may communicate information (e.g., commands and addresses,and/or data) by driving/transmitting signals on interconnects betweendevices. The circuits used to send these signals may be referred to asdrivers, transmitter, and/or output circuits. The circuits to receivethese signals may be referred to as receivers, samplers, and/or inputcircuits.

Multilevel modulation schemes may be used for the communication betweenintegrated circuits. An analog-to-digital converter (ADC) may be used aspart of a receiver for this communication. Some ADC based receivers cancompensate for relatively high channel loss when coupled with digitalequalization.

In an embodiment, a receiver includes a variable resolution ADC andvariable resolution processing logic/circuitry. The processing logic mayuse feed-forward equalization (FFE) techniques to process the outputsfrom the ADC. When receiving data from a channel having low attenuation,distortion, and/or noise, the ADC and processing logic may be configuredto sample and process the received signal using fewer bits, andtherefore less logic, than when configured to receiving data from achannel having a higher attenuation, distortion, and/or noise. Thus, thenumber of (valid) bits output by the ADC, and subsequently processed(e.g., for FFE) can be reduced when a receiver of this type is coupledto a low loss channel. These reductions can reduce power consumptionwhen compared to operating the receiver using the full (i.e., maximum)number of bits the ADC and processing logic is capable of processing.

FIG. 1 is a block diagram illustrating a digital data communicationsystem. In FIG. 1 , communication system 100 comprises a drivingintegrated circuit, a receiving integrated circuit, and a channelconnecting them. The driving integrated circuit includes transmittercircuit 110 (a.k.a., a driver). The receiver integrated circuit includesADC circuit 150 and resolution control circuit 120. The channel betweenthe driving integrated circuit and the receiving integrated circuitcomprises interconnect system 140. Interconnect system 140 wouldtypically comprise a printed circuit (PC) board, connector, cable, flexcircuit, other substrate, and/or a combination of these. Interconnectsystem 140 may be and/or include one or more transmission lines. Itshould also be understood that although system 100 and other describedherein are illustrated as receiving a single-ended signal, the signalssent by the driving integrated circuit of system 100 via interconnectsystem 140 and received by receiving integrated circuit (e.g., sampledby ADC 150) may be and/or represent a pair of differential signals.

The output of driver 110 is connected to a first end of interconnectsystem 140. The second end of interconnect system 140 is connected tothe input of ADC 150. Resolution control 120 is operatively coupled toADC 150. Resolution control 120 is operatively coupled to ADC 150 inorder to control the number of bits (and therefore the power consumed)output by ADC 150 when it converts the analog voltage at ADC 150's inputto a digital value. In an embodiment, resolution control 120 controlsthe number of bits output by ADC 150 (and therefore the power consumed)based on the channel loss (a.k.a., attenuation) of interconnect system140. Resolution control 120 receives an indicator (e.g., low, medium,high, dB of loss, number of bits to convert/output, etc.) of the channelloss (a.k.a., attenuation) of interconnect system 140.

FIGS. 2A-2C are diagrams illustrating variable resolution datareception. In FIGS. 2A-2C, receiving system 200 comprises variableresolution ADC 250, logic 230, and resolution control 220. The analoginput to ADC 250 is coupled to interconnect network 240. The variablebit-width output of ADC 250 is operatively coupled to logic 230. Eachbit from the least-significant bit (LSB) to the most-significant bit(MSB) output by ADC 250 are provided to logic 230.

In an embodiment, one or more bits generated by ADC 250 may beassociated with ADC sampling and/or calibration circuitry 252-253 thatcan be inactivated, or not used, when the corresponding bit is notoutput by ADC 250 (or is invalid.) In FIG. 2 , the LSB bit output by ADC250 is associated with circuitry 251. The next more significant bit(LSB+1) is associated with circuitry 252. The bits, and thecorresponding logic that is inactivated or not used (e.g., to save powerconsumption, etc.), are controlled by resolution control 220 in responseto an indicator of the channel attenuation of interconnect network 240.Thus, with lower resolution settings, support and/or calibrationcircuitry 251-252 not required when a reduced number of valid bit areoutput may be powered down. Powering-down may include reducing biascurrents (quiescent) in lower resolution modes. In an embodiment,receiving system 200 only fully powers-up a minimum amount of hardwareelements needed to maintain the link performance, and/or reduces thepower of unused elements that cannot be powered down completely.

In FIG. 2 , each bit provided by ADC 250 to logic 230 is associated withrespective logic sub-blocks 231-236 that can be inactivated, or notused, when the corresponding bit is not output by ADC 250 (or isinvalid.) The bits, and the corresponding logic that is inactivated ornot used (e.g., to save power consumption, etc.), are controlled byresolution control 220 in response to an indicator of the channelattenuation of interconnect network 240. Logic sub-block 231 isassociated with processing the LSB output by ADC 250. Logic sub-block232 is associated with processing the next more significant bit (i.e.,LSB+1) output by ADC 250. Logic sub-block 233 is associated withprocessing bit LSB+2 output by ADC 250. This pattern continues for allof the bits output by ADC 250. This is further illustrated in FIG. 2where logic sub-block 234 is associated with processing MSB−2; logicsub-block 235 is associated with processing MSB−1; and, logic sub-block236 is associated with processing the most significant bit—MSB.

Logic 230 may be, for example, circuitry to process the digital numbersoutput by ADC 250. In particular, logic 230 may perform feed-forwardequalization based on the outputs of ADC 250. In FIG. 2A, ADC 250 andlogic 230 are illustrated as providing and using all of the bitsavailable from ADC 250. The output of logic 230 is one or more bitsOUT[P:0], where P is an integer greater than or equal to zero. Forexample, when a 2-level pulse-amplitude modulation (PAM-2) signal isbeing received by receiver system 200, logic 230 may be configured tooutput a single bit—OUT[0]. In another example, when a 4-levelpulse-amplitude modulation (PAM-4) signal is being received by receiversystem 200, logic 230 may be configured to output two bits—OUT[1:0], andso on.

As discussed herein, portions (and/or sub-blocks 231-236) of logic 230may be inactivated by resolution control 220 based on an indicator(ATTEN) associated with the attenuation of interconnect network 240.This is further illustrated by example in FIGS. 2B and 2C.

In FIG. 2B, resolution control 220 has configured ADC 250 and logic 230to use a resolution that does not include (and/or ignores) theleast-significant bit (LSB) output by ADC 250. This is illustrated bythe “X” over the LSB output of ADC 250, a corresponding “X” over supportand/or calibration circuitry 251, and a corresponding “X” over sub-block231. Note that even at the reduced resolution illustrated in FIG. 2B,the output of logic 230 can still be the same one or more bits OUT[P:0],where P is an integer greater than or equal to zero.

In FIG. 2C, resolution control 220 has configured ADC 250 and logic 230to use a resolution that does not include (and/or ignores) the twoleast-significant bits output by ADC 250. This is illustrated by the X'sover the LSB and LSB+1 outputs of ADC 250, the corresponding X's oversupport and/or calibration circuitry 251 and 252, and the correspondingX's over sub-block 231 and sub-block 232.

It should be understood that, in an embodiment, the digital equalization(e.g., FFE) is two-step process: In the first step, a front-end convertsa received analog signal from the interconnect network 240 to a digitalform using an ADC (e.g., ADC 150 or 250). In the second step, logic 230(e.g., a digital signal processor (DSP), finite state machine,combinational logic, and/or a lookup table, etc.) equalizes thedigitized outputs from the ADC.

Resolution (i.e., the number of valid/used bits in each digital sample)in both the data conversion step/logic and the processing step/logic areparameters that affect the power consumed by the receiver system 200. Inan embodiment, a factor that determines the resolution used by receiversystem 200 is the channel loss of interconnect network 240.

For example, a higher FFE gain from logic 230 may be needed tocompensate long interconnect network channels that suffer from higherloss at baud-rate (e.g., 14 GHz for 56 Gb/s PAM-4 signaling). FFEamplifies both high frequency signal content and noise. In a receiversystem 200 that uses an ADC 250, quantization noise affects receiversystem 200's ability to correctly resolve the signaling levels.

For example, in a case where interconnect network channel 240 causes a30 dB loss to the transmitted signal, a higher resolution (e.g., morethan 5 bit) ADC may be required. However, at a lower channelattenuation, less FFE gain is required. This allows a lower resolution(e.g., less than 5 bit) ADC and logic 230 processing to have acceptableperformance.

This variable resolution sampling and processing can translate tosignificant power savings in both the ADC 250 and also in logic 230. Forexample, if ADC 250 is a flash type ADC (see, e.g., FIGS. 5A-5B), N bitresolution requires 2N−1 number of comparators are. In an embodiment, aflash type ADC 250 can be implemented to produce, when controlled byresolution control 220, the highest resolution number of bits. However,when controlled by resolution control 220 to operate at a lowerresolution some of the 2N−1 comparators can be disabled to reduce power.

In another example, if ADC 250 is a successive approximation type ADC(see FIG. 3 ), a bit decision is made starting from the MSB to towardsLSB for each successive approximation register (SAR) cycle. Asillustrated in FIG. 4 , for an N-bit digital output, ADC 250 williterate for N SAR cycles. Thus, when resolution control 220 configuresreceiver system 200 for lower resolution than the maximum, N, the numberof SAR cycles can be reduced to N−K. For a self-timed SAR ADC 250, poweris only consumed when the internal SAR comparator makes decisions. Thisfurther saves clock-tree power. Similarly, if ADC 250 is a multi-stagepipelined-ADC (see, e.g., FIG. 6A-6B), the later stages can be shutdown. This reduces the power consumed. Thus, it should be understoodthat in an embodiment, ADC 250 can be configured for lower resolutionthereby yielding a power savings for many types of ADCs.

In an embodiment, an interface (e.g., input to ADC 250) is coupled toreceive a signal that is conveyed via interconnect network channel 240.Interconnect network channel 240 attenuates the signal by an attenuationamount as the signal is conveyed by channel 240. An adjustableresolution analog-to-digital converter (ADC) 250 receives the signal viathe interface. Resolution control circuitry 220 determines a resolutionof ADC 250 based on the attenuation amount.

In an example, ADC 250 may correspond to a successive approximation typeADC. In this example therefore, resolution control circuitry 220 therebydetermines the resolution of ADC 250 by controlling the number ofsuccessive approximation iterations ADC 250 uses to convert the receivedsignal to a digital number.

In other examples, ADC 250 may correspond to a flash or pipeline typeADC. In these examples therefore, resolution control circuitry 220determines the resolution of ADC 250 by controlling the number ofquantization paths ADC 250 uses to convert the received signal to adigital number.

In an embodiment, logic 230 receives, from ADC 250, one or more digitalnumbers corresponding to the received signal. Logic 230 may be orcomprise feed-forward equalization circuitry. Logic 230 may produce,based on a processing of the one or more digital numbers, an equalizedoutput based on a finite impulse response filtering of digital numbersreceived from ADC 250. Resolution control circuitry 220 may alsodetermine the resolution logic 230 uses to process the digital numbersto produce the equalized output.

In an embodiment, an integrated circuit receives a signal frominterconnect network channel 240. Interconnect channel 240 attenuates atransmitted signal by an attenuation factor. Adjustable resolutionanalog-to-digital converter (ADC) 250 converts the signal from an analogparameter (e.g., voltage, current) to a variable resolution digitalvalue (e.g., VAL[N−1:0]) Resolution control circuitry 220 determines thenumber of valid bits that are in the variable resolution digital valuebased on the attenuation factor.

In an example, the number of valid bits in the variable resolutiondigital value may be controlled by setting a number of successiveapproximation iterations performed by the adjustable resolution ADC 250.In another example, the number of valid bits in the variable resolutiondigital value may be controlled by setting a number of activequantization paths used by the adjustable resolution ADC 250. The numberof valid bits in the variable resolution digital value may be controlledby activating and/or deactivating circuitry to be used by the adjustableresolution ADC 250 (e.g., comparators, stages, etc.).

In an embodiment, ADC 250 produces a time series comprising two or morevariable resolution values. Logic 230 circuitry digitally processes thetime series using circuitry that is activated based on the number ofvalid bits in the variable resolution digital value. This digitalprocessing of the time series may comprise feed-forward equalizationprocessing. In an embodiment, adjustable resolution ADC 250 comprises aplurality of interleaved ADC converters.

In an embodiment, logic 230 at least feed-forward equalizes the timeseries of samples. Logic 230 may use a variable number of FFE taps wherethe number of FFE taps that are activated (or deactivated) is based onthe variable resolution digital value. Likewise, for example, portionsand/or sub-blocks 231-236 of logic 230 that are associated with unusedor deactivated FFE taps may also be disabled.

FIG. 3 is a block diagram illustrating a successive approximationanalog-to-digital converter (ADC). In FIG. 3 , SAR ADC 350 includes asample-and-hold (S/H) 351, comparator 352, digital-to-analog converter(DAC) 353, and finite state machine 355. ADC 350 receives an analoginput, VIN, a mode indicator, MODE, and a timing reference signal CK.FSM may also produce a signal, RUN, that indicates ADC 350 is iterating.

FSM is operatively coupled to control sample-and-hold (S/H) 351,comparator 352, digital-to-analog converter (DAC) 353. FSM receives thetiming reference signal, CK and the mode indicator, MODE. Mode indicatorMODE determines the resolution (i.e., number of bits) that ADC 350'soutputs. FSM controls the operation of S/H 351, DAC 353, and/orcomparator 352. FSM controls S/H 351 and DAC 353 in response to theoutput of comparator 352 to perform a binary search until every bit ofthe resolution configured by the MODE input is determined. While thisbinary search is being performed, FSM may output and indicator, RUN,that is associated with ADC 350 performing iterations to determine itsoutput VAL[N−1:0]. The resulting output VAL[N−1:0] indicates a digitalapproximation of VIN. In an embodiment, VAL[N−1:0] may be output (or beindicated to be valid) by FSM 355 at the end of the conversion (e.g.,when RUN is deasserted).

FIG. 4 is a timing diagram illustrating variable resolution operation ofa successive approximation analog-to-digital converter. In FIG. 4 ,three resolution modes are illustrated. In an N bit resolution mode, thesignal RUN is asserted from cycle 0 through cycle N−1—thus illustratingthat ADC 350 iterates and consumes power for N number of iterationcycles. This is illustrated by arrow 191. In an N−1 (i.e., lower)resolution mode, the signal RUN is asserted from cycle 0 through cycleN−2—thus illustrating that ADC 350 iterates and consumes power for N−1number of iteration cycles. This is illustrated by arrow 192. In an N−2resolution mode, the signal RUN is asserted from cycle 0 through cycleN−3—thus illustrating that ADC 350 iterates and consumes power for N−2number of iteration cycles when in the N−2 mode. It should be understoodthat when ADC 350 iterates fewer cycles, less power is consumed by ADC350.

FIGS. 5A-5B are diagrams illustrating variable resolution operation of aflash analog-to-digital converter. In FIGS. 5A-5B, flash ADC 550includes voltage divider 556, comparators 552 a-552 f, and decoder 555.Voltage divider 556 provides reference voltages to comparators 552 a-552f Comparators 552 a-552 f compare these reference voltages to the analoginput, VIN. The outputs of comparators 552 a-552 f are provided to adecoder (e.g., thermometer code decoder) in order to determine ADC 350'soutput VAL[N−1:0].

In an embodiment, some of comparators 552 a-552-f are disabled to reducepower consumption. This is illustrated in FIG. 5B. In FIG. 5B, ADC 550has been configured to produce a resolution that does not include(and/or ignores) the least-significant bit output by ADC 550. This isillustrated by the X's over comparators 552 b, 552 d, and 552 f and theoutput bits VAL[N−1:1] (contrast this with the VAL[N−1:0] output shownin FIG. 5A.)

FIGS. 6A-6B are diagrams illustrating variable resolution operation of apipeline analog-to-digital converter. In FIGS. 6A-6B, pipeline ADC 650includes stages 652 a-652 f. The outputs of stages 652 a-652 f areprovided to align and combine block 655 in order to determine ADC 650'soutput VAL[N−1:0].

In an embodiment, some of stages 652 a-652 f are disabled to reducepower consumption. This is illustrated in FIG. 6B. In FIG. 6B, ADC 650has been configured to produce a resolution that does not include(and/or ignores) the least-significant bit output by ADC 650. This isillustrated by the X over stage 652 f and the output bits VAL[N−1:1](contrast this with the VAL[N−1:0] output shown in FIG. 6A.)

FIG. 7 is a flowchart illustrating variable resolution data reception.The steps illustrated in FIG. 7 may be performed by one or more elementsof system 100, system 200, and/or one or more of their components. Anindicator of an attenuation associated with a channel is received (702).For example, resolution control 220 may receive an indicator associatedwith the attenuation or loss that occurs when a signal is sent viainterconnect network channel 240.

Based on the indicator, an output resolution for an analog-to-digitalconverter that receives the signal attenuated by the channel is received(704). For example, resolution control 220 may select an outputresolution for ADC 250 based on the received indicator, ATTEN. Based onthe indicator, select a processing resolution for circuitry thatreceives a series of digital numbers from the analog-to-digitalconverter (706). For example, resolution control 220 may select aprocessing resolution for logic 230 based on the received indicator,ATTEN.

The ADC is configured to operate using the selected output resolution(708). For example, resolution control 220 may configure ADC 250 toconvert and output fewer bits than ADC 250's maximum output resolution.The circuitry that receives the series of digital numbers from theanalog-to-digital converter is configured to operate using the selectedprocessing resolution (710). For example, resolution control 220 mayconfigure logic 230 to process fewer bits than ADC 250's maximum outputresolution. Resolution control may configure logic 230 to process fewerbits by disabling, inactivating, or powering-down sub-blocks (e.g.,sub-block 231) that are associated with bits that are not to beprocessed by logic 230. FIG. 8 is an illustration comparing eye diagramshaving different sampling and processing resolutions.

The methods, systems and devices described above may be implemented incomputer systems, or stored by computer systems. The methods describedabove may also be stored on a non-transitory computer readable medium.Devices, circuits, and systems described herein may be implemented usingcomputer-aided design tools available in the art, and embodied bycomputer-readable files containing software descriptions of suchcircuits. This includes, but is not limited to one or more elements ofsystem 100, system 200, and their components. These softwaredescriptions may be: behavioral, register transfer, logic component,transistor, and layout geometry-level descriptions. Moreover, thesoftware descriptions may be stored on storage media or communicated bycarrier waves.

Data formats in which such descriptions may be implemented include, butare not limited to: formats supporting behavioral languages like C,formats supporting register transfer level (RTL) languages like Verilogand VHDL, formats supporting geometry description languages (such asGDSII, GDSIII, GDSIV, CIF, and MEBES), and other suitable formats andlanguages. Moreover, data transfers of such files on machine-readablemedia may be done electronically over the diverse media on the Internetor, for example, via email. Note that physical files may be implementedon machine-readable media such as: 4 mm magnetic tape, 8 mm magnetictape, 3½ inch floppy media, CDs, DVDs, and so on.

FIG. 9 is a block diagram illustrating one embodiment of a processingsystem 900 for including, processing, or generating, a representation ofa circuit component 920. Processing system 900 includes one or moreprocessors 902, a memory 904, and one or more communications devices906. Processors 902, memory 904, and communications devices 906communicate using any suitable type, number, and/or configuration ofwired and/or wireless connections 908.

Processors 902 execute instructions of one or more processes 912 storedin a memory 904 to process and/or generate circuit component 920responsive to user inputs 914 and parameters 916. Processes 912 may beany suitable electronic design automation (EDA) tool or portion thereofused to design, simulate, analyze, and/or verify electronic circuitryand/or generate photomasks for electronic circuitry. Representation 920includes data that describes all or portions of system 100, system 200,and their components, as shown in the Figures.

Representation 920 may include one or more of behavioral, registertransfer, logic component, transistor, and layout geometry-leveldescriptions. Moreover, representation 920 may be stored on storagemedia or communicated by carrier waves.

Data formats in which representation 920 may be implemented include, butare not limited to: formats supporting behavioral languages like C,formats supporting register transfer level (RTL) languages like Verilogand VHDL, formats supporting geometry description languages (such asGDSII, GDSIII, GDSIV, CIF, and MEBES), and other suitable formats andlanguages. Moreover, data transfers of such files on machine-readablemedia may be done electronically over the diverse media on the Internetor, for example, via email

User inputs 914 may comprise input parameters from a keyboard, mouse,voice recognition interface, microphone and speakers, graphical display,touch screen, or other type of user interface device. This userinterface may be distributed among multiple interface devices.Parameters 916 may include specifications and/or characteristics thatare input to help define representation 920. For example, parameters 916may include information that defines device types (e.g., NFET, PFET,etc.), topology (e.g., block diagrams, circuit descriptions, schematics,etc.), and/or device descriptions (e.g., device properties, devicedimensions, power supply voltages, simulation temperatures, simulationmodels, etc.).

Memory 904 includes any suitable type, number, and/or configuration ofnon-transitory computer-readable storage media that stores processes912, user inputs 914, parameters 916, and circuit component 920.

Communications devices 906 include any suitable type, number, and/orconfiguration of wired and/or wireless devices that transmit informationfrom processing system 900 to another processing or storage system (notshown) and/or receive information from another processing or storagesystem (not shown). For example, communications devices 906 may transmitcircuit component 920 to another system. Communications devices 906 mayreceive processes 912, user inputs 914, parameters 916, and/or circuitcomponent 920 and cause processes 912, user inputs 914, parameters 916,and/or circuit component 920 to be stored in memory 904.

The foregoing description of the invention has been presented forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed, andother modifications and variations may be possible in light of the aboveteachings. The embodiment was chosen and described in order to bestexplain the principles of the invention and its practical application tothereby enable others skilled in the art to best utilize the inventionin various embodiments and various modifications as are suited to theparticular use contemplated. It is intended that the appended claims beconstrued to include other alternative embodiments of the inventionexcept insofar as limited by the prior art.

1. (canceled)
 2. An integrated circuit, comprising: an interface to be coupled to receive a signal that is conveyed via a signal channel, the signal channel to attenuate the signal by an attenuation amount as the signal is conveyed by the signal channel; an analog-to-digital converter (ADC) to receive the signal via the interface; adjustable resolution equalization circuitry to receive, from the ADC, a first digital number representing the received signal and to produce a second digital number based at least in part on a digital finite impulse response filtering of a plurality of digital numbers previously received from the ADC; and control circuitry to determine a resolution of the equalization circuitry based on the attenuation amount.
 3. The integrated circuit of claim 2, wherein the resolution of the equalization is based at least in part on link performance.
 4. The integrated circuit of claim 2, wherein a number of taps that are used to implement the digital finite impulse response filtering is based on the attenuation amount.
 5. The integrated circuit of claim 2, wherein the ADC is configurable to have a plurality of resolutions.
 6. The integrated circuit of claim 5, wherein the ADC is to operate, at least in part, as a successive approximation type ADC.
 7. The integrated circuit of claim 5, wherein the control circuitry adjusts a number of comparisons performed by the ADC per digital number produced.
 8. The integrated circuit of claim 5, wherein the ADC is to operate, at least in part, as a flash type ADC.
 9. An integrated circuit to receive a signal from a channel that distorts and attenuates a transmitted signal corresponding to an attenuation indicator, comprising: an analog-to-digital converter (ADC) to convert the signal from an analog parameter to a first time series of digital values; adjustable resolution equalization circuitry to receive the first time series of digital values and to produce a second variable resolution time series of digital values based at least in part on a digital finite impulse response filtering of the first time series of digital values; and control circuitry to, based on the attenuation indicator, determine a resolution of the digital finite impulse response filtering calculations.
 10. The integrated circuit of claim 9, wherein the resolution of the equalization is further based at least in part on link performance.
 11. The integrated circuit of claim 10, wherein a number of taps that are used to implement the digital finite impulse response filtering is based on the attenuation indicator.
 12. The integrated circuit of claim 9, wherein the ADC is configurable to have a plurality of resolutions.
 13. The integrated circuit of claim 12, wherein the ADC is to operate, at least in part, as a successive approximation type ADC.
 14. The integrated circuit of claim 12, wherein the control circuitry adjusts a number of comparisons performed by the ADC per digital number produced.
 15. The integrated circuit of claim 12, wherein the ADC is to operate, at least in part, as a flash type ADC.
 16. A method of producing a digital time series representation of a signal attenuated by a channel, comprising: receiving an attenuation indicator corresponding to an attenuation of the channel; an analog-to-digital converter (ADC) that receives the signal attenuated by the channel and produces a first time series of digital values based on the signal attenuated by the channel; and based on the attenuation indicator, selecting a processing resolution for adjustable resolution equalization circuitry that receives a first time series of digital values and produces a second time series of digital values based at least in part of a digital finite impulse response filtering of a portion of the first time series of digital values already received from the ADC.
 17. The method of claim 16, wherein the processing resolution for the adjustable resolution equalization circuitry is further based at least in part on link performance.
 18. The method of claim 16, wherein a number of taps that are used to implement the digital finite impulse response filtering is based on the attenuation indicator.
 19. The method of claim 16, wherein the ADC is configurable to have a plurality of resolutions.
 20. The method of claim 16, wherein the ADC is operating, when producing the first time series of digital values, at least in part as a successive approximation type ADC.
 21. The method of claim 16, further comprising: adjusting a number of comparisons performed by the ADC per digital number produced. 